Recently, multiple units of GETECH's N2 Purge Stocker (Nitrogen-Filled Wafer Storage System) have been successfully deployed and are operational at a leading domestic 12-inch wafer fab. This breakthrough signifies that domestic N2 Purge Stockers can now meet the high-end storage requirements of logic chip, memory production line, automotive-grade power device, and advanced packaging and testing processes. It completely breaks the monopoly of foreign brands in the "high-purity storage" domain, providing critical support for building a self-reliant and controllable "storage lifeline" for Chinese semiconductor fabs.

As is well known, in semiconductor manufacturing, wafers undergo dozens of process steps from lithography to packaging. Environmental fluctuations during each storage and handling instance directly impact yield. Therefore, creating a storage environment with "high purity, low oxygen, low humidity, and low vibration" has become a core necessity for advanced production lines to ensure yield—and the N2 Purge Stocker is the key equipment to achieve this goal.

However, traditional N2 Purge Stockers face the following pain points and bottlenecks:

Loss of Purity Control: Conventional storage struggles to maintain a Class 100 ultra-clean environment; fluctuations in nitrogen concentration cause wafer surface oxidation.

Manual Intervention Risks: Manual scanning/handling introduces particulate contamination, with error rates as high as 0.5%.

Energy Efficiency Bottlenecks: Traditional nitrogen purging schemes suffer from nitrogen loss exceeding 30%.

Material Damage Risk: Wafers are susceptible to cracking or displacement due to vibration during transport.

As a leading industrial intelligence enterprise, GETECH implements its holistic "AI + CIM + AMHS" solution in the semiconductor sector. Since launching its AMHS business in 2024, GETECH has continuously deepened its expertise in intelligent equipment represented by OHT (Overhead Hoist Transport) systems and Stocker wafer storage systems.

In March 2025, GETECH launched its next-generation N2 Purge Stocker, addressing the above challenges through four-dimensional upgrades:

01 Class 100 Purity + Self-Circulating Purification

An embedded FFU laminar flow system maintains a Class 100 environment in real-time. Coupled with a built-in self-circulating purification module within the chamber, it enables dynamic control of particulate concentration (≤100 particles ≥0.5μm per cubic meter of air). A nitrogen closed-loop management system and intelligent gas path design reduce nitrogen loss by 70%, maintaining a stable concentration of 90% ± 2% (24-hour fluctuation < 3%).

02 Automatic Material Calling Function

Automatic scanning and AGV coordination enable "lights-out operation," eliminating risks associated with manual intervention.

03 AI Adaptive Control

Real-time monitoring of environmental factors like oxygen, humidity, and particles. AI algorithms dynamically optimize purification and nitrogen purging strategies.

04 Active Anti-Vibration Design

Vibration resistance design < 0.5G, mitigating risks of microscopic displacement.

In the future, GETECH will continue to optimize the technical parameters of its Stocker products, such as improving handling efficiency, positioning accuracy, and safety redundancy, to meet the needs of semiconductor production lines for scaling and automation upgrades. Simultaneously, it will also enhance solutions for mixed storage of 8-inch and 12-inch wafers, improving product compatibility and scalability.

The deployment of GETECH's next-generation N2 Purge Stocker not only fills a technological gap in domestic high-end storage equipment but also, through its integrated "AI + CIM + AMHS" solution, provides comprehensive support—spanning algorithms, software, and hardware—for smart manufacturing in semiconductor fabs, propelling China's semiconductor industry towards greater global competitiveness.